TLSR827x & TLSR8355 Series

TLSR827x and TLSR8355 series presents the Telink-developed Bluetooth LE + IEEE802.15.4 multi-standard wireless SoC solution with internal Flash and audio support, which combines the features and functions needed for all 2.4GHz IoT standards into a single SoC. The chip supports standards and industrial alliance specifications including Bluetooth Low Energy (up to Bluetooth 5.1), BLE Mesh, 6LoWPAN, Thread, Zigbee, RF4CE, HomeKit, ANT and 2.4GHz proprietary standard.

Part Number SRAM Flash Protocol Test Report Package Size
TLSR8278F1KET48 64KB 1MB Multimode BLE5.1+2.4G+mesh Reliability QFN48-SIP 7x7x0.75mm-0.5
TLSR8273F512ET32 64KB 512KB BLE5.1+2.4G QFN32-SIP 7x7x0.75mm-0.5
TLSR8271F512ET32 32KB 512KB BLE5.1+2.4G Reliability QFN32-SIP 5x5x0.75mm-0.5
TLSR8271F512ET24 32KB 512KB QFN24-SIP 4x4x0.75mm-0.5
TLSR8355F128ET24 32KB 128KB 2.4G Reliability QFN24-SIP 4x4x0.75mm-0.5
Tx +10dBm
Rx -97dBm@BLE1Mbps
-100dBm@802.15.4
Power Consumption Power@3V:
TX_whole_chip_5.4mA@0dBm
RX_whole_chip_5.3mA
Sleep_with_SRAM:~1uA
Sleep_with_external_wakeup:0.4uA
For other packages options, please contact Telink Sales team

Datasheet

827x and 8355 Reference Design

Reference Design Chipset Quick Guide SDK Download SDK Development Manual HW Design Document
BLE Generic TLSR8278 SDK beta V1.0.0
2.4G proprietary(RFID&ESL) TLSR8355 2.4G Propriatery SDK V3.1.0

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