Smart Lighting and Home Automation Solution


Introduction


Telink has always been committed to leading the charge on IoT innovation, particularly when it comes to connectivity technology. To empower smart home device manufacturers to deliver cutting-edge products, Telink have developed multi-mode SoCs that can be configured with multiple types of firmware during the software preprogramming and manufacturing process. Whether a use case calls for Bluetooth LE, Bluetooth Mesh, Telink Mesh, Zigbee, HomeKit, or Thread, Telink’s hardware gives device manufacturers everything they need. Telink’s solution has been adopted by Tier 1 customers worldwide.


Part Number
Function SRAM FLASH PWM Temperature
TLSR8258F1KET32 Bluetooth® Mesh / Zigbee (Dual Boot)
Bluetooth® LE + Zigbee Concurrent Mode
Bluetooth® LE + RF4CE
64K 1M 6 -40℃~+85℃
TLSR8258F512ET32/AT32 Bluetooth® Mesh / Zigbee 64K 512K 6 ET32: -40℃~+85℃
AT32: -40℃~+125℃
TLSR8253F512ET32/AT32 Bluetooth® Mesh 48K 512K 6 ET32: -40℃~+85℃
AT32: -40℃~+125℃
TLSR8278F1KET48 Bluetooth® Mesh / Zigbee 64K 1M 6 -40℃~+85℃
TLSR8273F512ET48 Bluetooth® Mesh 64K 512K 6 -40℃~+85℃
TLSR921x Bluetooth® Mesh + Zigbee + Open Thread +
HomeKit + Local KWS
256K 1M 6 -40℃~+85℃


Telink’s multi-standard ultra-low-power IC features flexible configuration variations that are tailored to meet the diverse requirements of clients’ products in a cost-effective way. These variations offer different options for supported protocols, memory size, number of PWM channels, and operating temperature range.


Clients who are looking for simple Bluetooth Mesh applications may choose our 8253 or 8273 chip, which feature the most cost-effective solution. Those who want their products to be compatible with multiple protocols may choose the more advanced 8258 or 8278 chip.


Telink’s latest TLSR9 Series RISC-V SoC supports local keyword spotting (KWS) and voice command recognition. It features fast response to voice commands, especially suitable for devices that requires low latency simple control.


Multi-Protocol Support


Since day one, Telink has led the charge on IoT connectivity technology innovation. Depending on a client’s product needs, Telink’s multi-mode hardware can be configured with different types of firmware during the software preprogramming and manufacturing process, including Bluetooth® Mesh, Telink Mesh, Zigbee, HomeKit, or Thread. Telink’s chips can also be used to produce the following three types of multi-mode devices:

Dual-boot mode

  • Both types of firmware are burned at different sections for Flash during manufacturing (e.g. Bluetooth® Mesh and Zigbee).
  • Boot settings determine which image to boot from, and the device can switch to the other protocol after reboot.
  • External triggers such as special key combinations can be used to initiate reboot.

Dual-pair mode

  • Devices are shipped from the factory with support for both protocols in unified firmware (e.g. Bluetooth LE and Zigbee).
  • When powered up, the device automatically searches for either protocol to pair with.
  • Once paired, the device works in the paired mode until it is factory reset.

Concurrent mode

  • Devices are shipped with unified firmware.
  • When powered up, devices can pair with a Bluetooth LE device and can also join another network (e.g. Zigbee).
  • Devices can maintain Bluetooth LE connection and perform other tasks at the same time.


Innovative Intelligent System


  • Telink can provide customized SDKs to those qualified clients, enable products to connect to the world’s major IoT ecosystems.
  • Telink also can provide Bluetooth® Mesh + Local Keyword Spotting (KWS) and Voice Command solution featuring low latency control.
  • Positioning beacon interleaved with Mesh traffic.
  • AoA/AoD packets can interleave with Mesh traffic.
  • Prototype and reference design is ready for early customer evaluation.



→ Bluetooth® Mesh

→ Zigbee

→ Zigbee + Bluetooth® LE Concurrent Mode

→ HomeKit

  • Telink only provides support for qualified clients with valid MFi license, Please contact Telink Sales Team for more details.

→ Matter